Printed circuit boards, otherwise known as PCB are found in almost all electronic devices. In manufacturing of PCB, electricians who are amateurs can make their own boards by drawing a design and then giving it to the manufacturer. There are three types; single sided, multi layered and double side boards. They are usually conducted with nickel, copper or aluminum material, and the type used is determined by the complexity and density of the circuits. The process of making them is described below.
A conductive material is used to plate the backing. Conduction between the layers is enhanced by drilling holes into the backing. To remove any small conductor particles that may be present, the board is scrubbed. Filtration process is applied to recycle the recovered particles. This is because, if not recycled, the copper may form a mixture with the other wastes and then become quite hazardous to the environment.
The next step is the cleaning of the board. It is also etched in order to enhance adhesion in the step that follows next. After this, another layer of conductor is added. The previously drilled holes should also be conducted and electrolysis copper plating is one of the processes that can be applied here. In order to balance the pH, it is essential to use an alkaline solution a well add some acidic solutions like copper sulfate.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The last stage is the formation of multi layer panels. This is done by assembling together the inner cores of the layer. The assembled panels take the shape of a book that is composed of copper foil that has epoxy sheets alternating with each other.
High heat and pressure are applied to the book which is placed in a lamination press. A bond will be formed as the epoxy layers are melted down by the intense heat and pressure. Holes are drilled into it. However, this should only be done after it has been trimmed and buffed as required. The desired results can only be achieved by following the required procedure well and adhering to each and every detail in the stages involved in manufacturing of PCB.
A conductive material is used to plate the backing. Conduction between the layers is enhanced by drilling holes into the backing. To remove any small conductor particles that may be present, the board is scrubbed. Filtration process is applied to recycle the recovered particles. This is because, if not recycled, the copper may form a mixture with the other wastes and then become quite hazardous to the environment.
The next step is the cleaning of the board. It is also etched in order to enhance adhesion in the step that follows next. After this, another layer of conductor is added. The previously drilled holes should also be conducted and electrolysis copper plating is one of the processes that can be applied here. In order to balance the pH, it is essential to use an alkaline solution a well add some acidic solutions like copper sulfate.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The last stage is the formation of multi layer panels. This is done by assembling together the inner cores of the layer. The assembled panels take the shape of a book that is composed of copper foil that has epoxy sheets alternating with each other.
High heat and pressure are applied to the book which is placed in a lamination press. A bond will be formed as the epoxy layers are melted down by the intense heat and pressure. Holes are drilled into it. However, this should only be done after it has been trimmed and buffed as required. The desired results can only be achieved by following the required procedure well and adhering to each and every detail in the stages involved in manufacturing of PCB.
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